Thu, May 28th - 2:17AM
How to choose the best laser for your marking application
Given the numerous types of lasers and materials involved, picking the best laser for a marking application can be a
challenge. An understanding of the laser characteristics and the material properties is essential to making an
optimal choice.
In laser marking processes, the type of material, quality of mark required, and speed will all play a role in the
optimum choice of laser. Although solid-state continuous-wave and CO2 lasers are used for marking, they are generally
not used to mark metal, so this article will focus on solid-state pulsed lasers. Within that category, there are
several technology options when choosing a pulsed laser for marking. These include Nd:YAG, Nd:YVO4 (vanadate), and
fiber lasers, each with its pros and cons.www.lasermarkingcnc.com
It is also important to understand how the material to be marked absorbs laser light at the wavelength of the laser
chosen. Ferrous and non-ferrous materials have excellent absorption at 1064 nm, while precious metals do so at 355
and 532 nm. Plastics also absorb the higher wavelength laser output.
The Nd:YAG laser was introduced more than 25 years ago and is the workhorse of the industry. Originally these lasers
were lamp-pumped, but have subsequently evolved so that diode pumping is now most common. The diode-based systems are
robust with excellent mean time before failure (MTBF). Some manufacturers expect more than 35,000 hours of life prior
to failure of the diodes. One advantage of Nd:YAG lasers is their beam quality, which leads to a smaller spot size of
the laser. The small spot size, along with short pulses, produces high peak power that can be beneficial in deep
engraving with crisp, clear marks and small characters.
The vanadate laser can emit at three different wavelengths: 1064, 532 (green), and 355 nm (blue). Vanadate lasers are
also diode-pumped and deliver beam quality with pulse-to-pulse stability,www.lasermarkingcnc.com making them well suited for ablation
marking and heat-affected zone (HAZ) applications. One of the vanadate laser markets is day/night marking—an
automotive application in which a top coating is removed to allow light to backlight buttons at night—typically
ablating a top coating to expose a lower surface without damaging it.
Approximately six years ago, fiber lasers were introduced to the marking world and have been the topic of discussion
in virtually every marking opportunity. The fiber laser does not have the same beam quality as Nd:YAG or vanadate
lasers, which limits the amount of peak power available. The fiber laser can anneal stainless steel due to its long
pulsewidth and larger spot size, putting more heat in the part to draw the carbon to the surface. It’s worth noting
that there only a handful of fiber-laser manufacturers that offer the laser source to a third party for integration
into a marking system.
In terms of operating costs and consumables, these three laser technologies are almost identical, so an end user can
choose the optimum laser technology without having to make cost tradeoffs. One thing to keep in mind is that the
output power of all solid-state lasers degrades over time, but it is possible to calibrate the system to maintain the
same power in the laser as the day it left the factory. This will allow the laser to maintain the same mark quality
and speed as the day it arrived and was put into production.
Applications
The most common terms used in laser marking include: engraving, annealing, ablation, and color change of plastics
(see video). Each of the lasers discussed can be chosen to optimize the performance of the laser marking process.
When ablating day/night design components, a vanadate laser performs well due to the short pulses and pulse-to-pulse
stability at higher repetition rates. This allows removal of a painted top surface without damaging pad-printed
plastic base material. Ablation also is a common practice in marking anodized aluminum, which is by far the most
forgiving laser process.
Another very common application is annealing stainless steel and titanium medical components such as implants and
instruments. Here, it is important to have high concentrated peak energy with a slightly longer pulse duration in
order to draw the carbon to the surface to achieve a crisp dark mark that will withstand test requirements such as
passivation and autoclave www.lasermarkingcnc.com cycles.
When engraving material, it is important to have optimum parameters in regard to frequency and speed in order to
evaporate the material. Typically, lasers with short pulses and high peak power perform best for this application.
All three laser technologies will have a place in industrial manufacturing for years to come. The technology will
continue to evolve in order to meet the changing demands of the manufacturing environment. When selecting a laser
marker, it is important to partner with a laser company that can demonstrate the advantages of each technology as it
relates the material to be marked. Many manufacturers have application labs that will test materials with a laser
that fits in regard to speed, quality, and budget.
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Wed, May 27th - 2:51AM
fiber laser marking systems
A standard laser marker uses a 2-Axis X and Y scanner to scan laser light across a level surface. KEYENCE’s 3-Axis
control laser marker is equipped with a Z axis scanner in addition to the X and Y axis scanners. It achieves three-
dimensional laser tracking by controlling all axes simultaneously. “3-Axis Technology” was first developed by
KEYENCE and installed in our marking systems in 2006. This unique technology makes it possible to program complex
shapes and saves countless engineering hours during integration. These innovations are indispensable and allow for
reliable consistency on every mark. www.lasermarkingcnc.com KEYENCE’s YVO4 laser markers, Fiber laser markers and CO2 laser markers all
utilize the 3-axis technology to consistently deliver the most advanced laser engraving and laser etching quality.
Amada Miyachi has developed a process for high quality precision laser cutting and laser micromachining of metals
under 0.5mm thick using a fiber laser marker with high speed XY galvo beam delivery. This cost effective process
offers both laser cutting and laser drilling capabilities and is particularly suited for cutting thin, reflective
materials like gold or copper. Typical applications for this laser cutting process include micro-electronics,
semiconductors, and solar cells/grids. It is also useful for cutting prototype lead frames or other thin sheet metal
parts with an underside burr of less than 0.0005”.
This laser cutting process does not require assist gas, but a low pressure flow of gas can be used to protect the
optics to direct particulate matter away from the workpiece.
he fiber lasers have become the clear industry standard for marking applications by delivering lower capital costs,
lower operating costs, and superior marking performance.
The Langolier fiber laser marker is truly a portable (on wheels) system that can be brought to the work rather than
always having to have the work brought to the marker.
Durable Markings with High Contrast:
The laser marks virtually all metals and plastics and various other materials with high contrast and without adding
any undesirable substance www.lasermarkingcnc.com
In most cases the typical physical effect of the laser marker induces a color change within the material so there is
no surface modification by corrugations or burrs
Different marking methods and laser sources (solid state and CO2) are used, to achieve the best results on every type
of material
Flexibility:
Laser marking is highly flexible process compared to any other marking process
It can mark any images and fonts without changing any punch, die, stencil etc
Unlike other conventional process
Laser Marking Features:
Uses Fiber laser sources
Visible pilot beam shows marking location
Supports bar code marking
It offers a non-contact, abrasion-resistant, permanent laser mark onto almost any type of material
No pre or post processing – Can be done on finished products
Visible Pilot beam shows the marking location for fast, accurate setup
Laser marking helps significantly in cutting operating cost by reducing labor cost, tool cost, consumable cost, set
up time, rejection improved cycle time www.lasermarkingcnc.com
of the prime advantage of laser marking is that it can be atomized and can be integrated with any online process
Use of Laser Marking:
With support of software variable serial numbers, batch numbers, Date Coding and 1D, 2D barcode can be marked
Text marking with all Windows True Type Fonts
Mark on Jewelery,Medical Instruments,Automotive,Consumer Goods,Electronics Parts and Giftware etc
Clean Plastic and Metal Surfaces
Engrave Deep or Fine
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Mon, May 25th - 2:38AM
How to choose fiber laser cutting machine
How to choose fiber laser cutting machine in China? I believe it has become a hot issue plagued metal processing manufacturers. It is necessary to choose the right price but high performance laser equipment that meet their processing needs, and improving competitiveness, so many people don’t know how to choose a laser machine.
Fiber laser cutting machine is a wonderful work in China laser technology development. Rapid development of laser technology led to social industry fast development. As we all known, fiber laser cutting machine is suitable for a variety of sheet metal pipes’ cutting, hollow, marking or other processing, like stainless steel, carbon steel plate, galvanized sheet, thin aluminum or thin copper or other metal materials.www.lasermarkingcnc.com As China is a famous processing country in the world, especially metal industry, so choosing right fiber laser cutting machine is important.
There are messy range and brand fiber laser cutting machine in the market, how to pick a good performance, affordable laser machine but also with excellent after-sales service, which is a difficult problem for many manufacturers. Been doing first-class products, first-class enterprises, first-class talents, Han’s Yueming Laser has been atwww.lasermarkingcnc.com the forefront of the industry for 15 years, and constantly develops excellent laser equipment for various industries. CMA1530C-G-A fiber laser cutting machine, which has fast processing speed, low running cost, is definitely the most optimal cost.
How Does Laser Marking Work?
Several types of laser marking machines exist, but the most up-to-date technology available is that of the fiber laser. This kind of laser machine, widely considered to be the best option in existence, uses fiber pumping technology to “dope” the fibers with a rare-earth element such as Ytterbium.
The use of this element increases the ability of the fibers to conduct light-emitting diodes, which are then pumped through the fibers to the optical heads. At that point, the beam of light expands to create the laser marking capability. The beam of light then marks the material using one of four methods:
Laser engraving
Ablation or removal of a layer of the material
Carbon migration or etching of the surface of the material to change the color
Bonding
You can use fiber laser marking on a wide range of materials, from different types of metal through to leather and plastics. Types of metals that lend themselves well to fiber laser engraving include platinum, stainless steel, silver, gold and bronze. Carbide, tungsten, copper,www.lasermarkingcnc.com aluminum or medical-grade alloys also respond well to fiber laser marking.
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Thu, May 21st - 3:04AM
Laser Marking Systems
Our precision manufactured lasers and laser marking systems deliver the highest possible laser marking performance on a wide variety of materials, including anodized aluminum, plastics, wood, glass, marble, textiles and more. Universal’s systems can even mark some metals using our patented High Power Density Focusing Optics (HPDFO)™. Universal’s HPDFO produces a smaller, more concentrated beam spot that greatly increases the laser's power density. This makes it possible to directly mark stainless steel, iron, titanium, chromed steel and some exotic high-carbon metals without the need for metal marking compounds. Laser marking is a non-contact, permanent process that marks without the stress points and deformation produced by other marking methods. It is ideal for metals that are subject to hot, wet, abrasive or corrosive environments. www.lasermarkingcnc.comUniversal’s systems are capable of maintaining extremely tight tolerances and clearly etching fonts as small as 2pt, as well as barcodes, UID codes and data matrix codes that conform to ASTM standards. Accurately, quickly and easily laser mark barcodes, serial numbers, text and logos created in any graphics software or labeling program.
Learn about the flexibility of Universal Laser Systems' PLS6MW, a Multi-Wavelength Laser Platform™ that allows the user to painlessly switch between fiber laser marking and CO2 laser marking and cutting applications, all in one machine.
F series pulsed fiber lasers are utility lasers which work with a range of metals and plastics and are used by industrial manufacturers to mark their products. Customers in the automotive, electrical and electronics, medical devices and other industries can choose from a range of power options to get the right product at the right price for their specific needs. F series lasers are easy to install and integrate. They are equipped with an on-board computer making an external PC unnecessary and are easy to network. They are easy to use: they use Marca software to code and mark precisely and consistently.
ADVANTAGES OF LASER MARKING
Marking with lasers offers a permanent, high-speed, and non-contact solution to your part marking needs. No masks or stencils are required and there is generally no thermal or mechanical stress on the part. Using industrial lasers, galvanometric imaging systems, and computer control, CMS Laser manufactures custom laser marking systems designed for to meet your business’s exact needs, and to optimize your actual application.
We can uniquely combine speed, permanence, and marking flexibility that cannot be matched by any other marking technique. Our markers are precise, versatile, highly reliable and cost-effective.
LASER MARKING METHODS
Several different methods of marking materials fall under the umbrella of “laser marking”. Each affects the material differently and some materials might react to more than one of the methods. It’s important to note that several variables play a part in which laser and method is best suited for your parts. Following is a high level breakdown of methods by material group.www.lasermarkingcnc.com
PLASTICS
Plastics can be marked with several different laser wavelengths and methods
Charring (carbonization) produces dark marks on light plastics.
Foaming produces light marks on dark plastics.
Ablation removes material by breaking the molecular bonds of the material, essentially vaporizing it.
causes various dyes and pigments mixed into the plastic to change color when exposed to various laser wavelengths.
Melting raises the temperature to the plastic’s melting point (not high enough for ablation) and creates marks that do not change from the original color.
Chemical Change can cause the color to alter as the laser beam interacts with the molecules in the material.
METALS
Metals generally absorb shorter wavelengths better, allowing them to accept permanent marking very well.
Ablation vaporizes the metal leaving behind empty space where the laser path traveled.
Oxidation creates an oxide layer which darkens the metal with no raised/lowered area or material debris.
Layer Removal takes away an added layer (painted/anodized) and leaves bare, unaltered metal exposed.
Melting can mark metals by change the surface texture of metals.
GLASS
Marking glass with lasers requires the capability of at least a small amount of light absorption. It is a fast, non-contact method of etching/engraving on glass, and also a debris/waste-free method of marking inside glass.
Micro-fracturing creates miniscule cracks by creating a significant temperature difference between the cold substrate and the heated beam path.www.lasermarkingcnc.com
3D Marking uses a tightly focused laser and varied focal point to cause the micro-fractures to take place between the two surfaces of the
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Mon, May 18th - 2:44AM
What Makes a TYKMA Laser Marking System the Best?
There are many reasons as to why our laser marking systems are the perfect solution to your engraving needs, such as:
Production-ready laser marking workstations ship fully assembled and are ready to mark with minimal setup.
Simple setup, programming and marking with Minilase™ and Zetalase™.
Our systems are designed to exacting quality standards.
Ergonomic design, user-friendly controls and cutting edge features provide the maximum operator experience.fiber laser marking systems
All of our systems feature high powered MOPA fiber laser engines.
Our systems ship fully assembled and carry comprehensive three year warranties.
Best of all, TYKMA offers a variety of support services to ensure that your laser marking systems are always working perfectly. Service and application technicians offer 24/7/365 support, which includes everything from machine set-up and training to troubleshooting and maintenance.http://www.lasermarkingcnc.com
Our goal is to always provide long-term customer support and training, helping your systems perform at the highest level for years to come. No matter what your company’s needs or objectives are, TYKMA will be there to meet them.
Learn More about Every TYKMA Laser Marking System
Contact TYKMA to find out how to implement our systems into your process. With a wide variety of available laser marking systems, we are sure to have the ideal solution for your unique application.
Complete part traceability is an essential component for compliance with ISO quality standards. Choosing laser marking technology provides manufacturers witih a reliable method of automating marking operations, and ensures a high level of control over component traceability. Put simply, laser technology consists of a high frequency beam generated from a laser source. This beam is then amplified and directed towards a part to be marked via a series of rotating mirrors. The reaction that takes place inside the material marked consists of 3 distinct processes fiber laser marking systems http://www.lasermarkingcnc.com
Fiber laser marking is widely recognized as one of the most effective marking technologies, and offers a multitude of solutions for any industry.
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Thu, May 14th - 2:47AM
Laser marking system and method using controlled pulse width of Q-switch
A laser marking system comprises a continuous-wave (CW) pumped Q-switch pulse laser and a laser controller. The Q-switch element switches on and off according to a repetition control signal received from the laser controller. The repetition control signal comprises an emission period in a repetition rate. The CW-pumped Q-switch pulse laser emits the laser beam through the Q-switch element during the emission period. The emission period or duty factor of the repetition control signal is adjusted such that the CW-pumped Q-switch pulse laser emits a pulse laser beam comprising a plurality of emission pulses during the emission period. The pulse laser beam is used to generate a scanning pulse laser beam which is focused on the workpiece to be marked in a desired pattern.
BACKGROUND OF THE INVENTION
1. Field of the invention
The present invention relates to a laser marking system, and in particular to a laser marking system and method for marking a workpiece with a laser beam scanning the surface thereof.
2. Description of the Related Art
Laser marking has been widely used to mark an electronic part with a specific pattern such as classification characters. Of the laser marking methods, there is known a beam-scanning marking method in which a laser beam scans the surface of the part in the specific pattern, which is disclosed in Japanese Patent Unexamined Publication Nos. 59-45091 and 60-221721. Generally, a solid state laser such as Nd:YAG laser is used as a laser light source.
The solid state laser is typically provided with a Q-switch scheme which causes pulse repetition emission with a relatively high peak output in power. In a beam-scanning system, as shown in FIG. 1, the Q switch switches on and off according to a control signal, which causes the solid state laser to emit the laser light beam during the OFF period of the Q switch. Conventionally, the OFF period, or the emission period, is set at 10 microseconds (μsec) during which the laser beam is emitted instantaneously.
However, when such a laser beam is focused on a certain position of the electronic part encapsulated in resin, the resin at that position is vaporized at an instant, and thereby a deep hole is formed reaching 50-100 micrometers in depth, as shown in FIG. 2. For this reason, the conventional laser marking method cannot be applied to a thin workpiece encapsulated in resin.
In order to reduce the peak level of the Q-switch laser beam, it is considered that the marking is performed by using the laser beam obtained by setting the repetition rate at 50 kHz or more so that the continuous-wave (CW) pumped Q-switch laser approaches a CW pumped laser. However, since the reduced peak level of the laser light causes the laser beam to decrease in power, it is necessary to lower the scanning speed of the laser beam so as to compensate for the power reduction, resulting in reduced performance of marking.
To avoid the reduced performance of marking, the scanning speed of the laser beam is usually kept at constant, and the repetition rate of the laser emission is adjusted to achieve the optimal condition of the laser marking system. However, a distance between adjacent holes produced by the laser beam is in reverse proportion to the repetition rate of the laser emission. Therefore, when the repetition rate is too low, adjacent holes are formed apart from each other, resulting in discontinuous marking lines. As the repetition rate is too high, the laser beam energy becomes denser, causing deeper holes than necessary. In other words, the conventional laser marking method cannot achieve clear marking lines having a relatively shallow depth.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a laser marking method and system which can mark a workpiece with a pattern having a relatively shallow depth.
Another object of the present invention is to provide a laser marking method and system which can mark a workpiece with a clear and relatively shallow pattern without decreasing the marking performance.
Still another object of the present invention is to provide a laser marking method and system for marking a workpiece with a pattern having increased visibility and a relatively shallow depth.
According to the present invention, a specific characteristic of a continuous-wave (CW) pumped Q-switch pulse laser is used to generate a pulse laser beam for marking. The present invention is based on the fact that laser emission pulses vary in intensity and number with the emission period of the CW-pumped Q-switch pulse laser. In other words, a plurality of laser emission pulses are generated by adjusting the emission period of the CW-pumped Q-switch pulse laser with the laser emission pulses varying in intensity. The plural laser emission pulses are caused by the primary laser oscillation and the relaxation oscillation. Since the relaxation oscillation causes a plurality of secondary emission pulses with the primary emission pulse reducing in intensity, the plural laser emission pulses including the primary emission pulse having a relatively low intensity can be obtained by only adjusting the emission period without decreasing the repetition rate of the emission pulses or the scanning speed of the pulse laser beam. Therefore, a marking pattern having a relatively shallow depth is achieved by using the pulse laser beam having the plural laser emission pulses to scan a predetermined surface of the workpiece.
According to an aspect of the present invention, there is used a laser source which comprises a laser medium and a Q-switch element. The laser medium is continuously pumped and the Q-switch element switches on and off according to a repetition control signal. The repetition control signal comprises an emission period in a repetition rate. The laser source emits the laser beam through the Q-switch element during the emission period. The emission period or duty factor of the repetition control signal is adjusted such that the laser source emits a pulse laser beam comprising a plurality of emission pulses during the emission period. The pulse laser beam is changed in two orthogonal directions according to a predetermined pattern to generate a scanning pulse laser beam. The scanning pulse laser beam is focused on a predetermined surface of the workpiece placed at a predetermined position.
Preferably, at least the predetermined surface of the workpiece comprises a thermoplastic resin containing carbon. By melting and vaporizing portions of the predetermined surface of the workpiece with the scanning pulse laser beam scanning in the predetermined pattern, the carbon contained in the thermoplastic resin is deposited on the portions. Therefore, after removing the deposited carbon from the predetermined surface of the workpiece, those portions on the surface are discolored, resulting in improved visibility of the marking pattern.
More specifically, the laser medium is a Nd:YAG rod and the Q-switch element is an acousto-optic diffraction switch such as a ultrasonic Q-switch element. Further, the repetition control signal has a fixed repetition rate falling within a range from 5 kHz to 50 kHz and the emission period is adjusted to a period ranging from 20 μsec to 200 μSec.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a waveform chart showing an conventional laser driving method in a laser marking system;
FIG. 2 is a schematic sectional view of a hole produced by vaporization according to the laser marking system as shown in FIG. 1;
FIG. 3 is a block diagram showing the circuit configuration of an embodiment of a laser marking system according to the present invention;
FIG. 4 is a detailed block diagram of a Q-SW driver in the embodiment;
FIG. 5 is a schematic side view of the laser marking system of FIG. 3;
FIG. 6 is a waveform chart showing a first embodiment of a laser driving method at the pulse width of 50 microseconds according to the present invention;
FIG. 7 is a waveform chart showing a second embodiment of the laser driving method at the pulse width of 80 microseconds according to the present invention;
FIG. 8A is a schematic sectional view of a hole produced by vaporization according to the first embodiment; and
FIG. 8B is a schematic sectional view of a hole produced by vaporization according to the second embodiment.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIG. 3, a laser marking system according to an embodiment of the present invention is provided with a continuous-wave (CW) pumped Q-switch laser 1 which comprises a Nd:YAG laser rod 100, a ultrasonic Q-switch element 101 and other necessary optical elements including a pumping light source and mirrors. The ultrasonic Q-switch element 101 comprises a ultrasonic medium and a transducer as well known, which switches on and off according to a Q-SW control signal as described later. The pulse laser beam emitted by the CW-pumped Q-switch laser 1 is reflected by an optical-axis adjusting mirror 102 before passing though a beam expander 103. The pulse laser beam is further reflected by a X-scanning mirror 104 and a Y-scanning mirror 105 to become a scanning laser beam which is focused through a f-θ lens 106 onto the resin surface of a workpiece. The X-scanning mirror 104 and the Y-scanning mirror 105 are driven by galvano-scanners 107 and 108, respectively.
The laser marking system is further provided with a main controller 109 comprising a pulse width controller 110 and a galvano-scanner controller 111. The pulse width controller 110 receives a pulse width control signal PWC and a rate control signal CYC from a computer 112 and outputs a control pulse signal to a Q-switch driver 113. According to the control pulse signal, the Q-switch driver 113 outputs the Q-SW control signal to the ultrasonic Q-switch element 101. When the Q-SW control signal is activated, the ultrasonic Q-SW element 101 stops the CW-pumped Q-switch laser 1 emitting the laser beam. When the Q-SW control signal is deactivated, the ultrasonic Q-SW element 101 causes the laser 1 to emit the laser beam having a plurality of pulses of laser light. In other words, the pulse width control signal PWC is determined so that two or more laser emission pulses are output from the CW-pumped Q-switch laser 1. The galvano-scanner controller 111 receives a galvano-scanner control signal GC from the computer 112 and outputs a drive control signal to a galvano-scanner driver 114. According to the drive control signal, the galvano-scanner driver 114 drives the galvano-scanners 107 and 108 so as to scan the pulse laser beam in a specific pattern preset in the computer 112.
As shown in FIG. 4, the Q-switch driver 113 receives the control pulse signal from the pulse width controller 110 of the main controller 109 and outputs the Q-switch control signal to the ultrasonic Q-switch element 101. A function controller 201 receives the control pulse signal from the pulse width controller 110 and a pulse signal of a predetermined frequency from a pulse generator 202 and outputs a modulating pulse signal Pm to a pulse modulator 203. The pulse modulator 203 performs pulse modulation of a radio-frequency (RF) signal RFC according to the modulating pulse signal Pm to output a modulated RF signal to a RF power amplifier 204. The RF signal RFC is obtained by a 1/2-divider 205 dividing a main RF signal generated by a primary oscillator 206. The modulated RF signal amplified by the RF power amplifier 204 is output as the Q-SW control signal to the ultrasonic Q-SW element 101 where the transducer generates a ultrasonic wave to switch between a high Q and a low Q according to the Q-SW control signal.
Referring to FIG. 5, the laser marking system is assembled on a stage 301 so that the elements achieve the following functions. The X-scanning mirror 104 reflects the pulse laser beam such that it scans in the X direction and the Y-scanning mirror 105 reflects the pulse laser beam reflected from the X-scanning mirror 105 such that it scans in the Y direction. The scanning pulse laser beam 302 reflected from the Y-scanning mirror 105 is focused through the f-θ lens 106 onto the surface of the workpiece 303. The workpiece 303 is covered with a resin containing carbon. The pulse width of the laser beam is determined in advance depending on the kind and/or thickness of the resin.
LASER DRIVING CONTROL fiber laser marking systems
The computer 112 uses the pulse width control signal PWC to designate the pulse width of the laser beam emitted by the CW-pumped Q-switch laser 1. More specifically, receiving the pulse width control signal PWC and the rate control signal CYC from the computer 112, the pulse width controller 110 outputs the control pulse signal comprising pulses having the designated pulse width and the designated repetition rate to the Q-switch driver 113. According to the control pulse signal, the Q-switch driver 113 modulates the RF signal RFC to output the Q-SW control signal to the ultrasonic Q-SW element 101. The ultrasonic Q-switch element 101 is in the ON state, or the diffraction state, while receiving the RF signal from the Q-switch driver 113. Therefore, when the Q-switch element 101 is in the ON state, the CW-pumped Q-switch laser 1 is in the low-Q state, resulting in no laser beam emission. However, energy is being stored into the Nd:YAG rod 100 by continuously pumping during such a period of no laser emission. When the RF signal stops, the ultrasonic Q-switch element 101 switches to the OFF state, which causes the CW-pumped Q-switch laser 1 to be in the high-Q state, resulting in the laser beam emission. The state of the pulse beam emission is determined by the OFF state period (or the emission period) and the ON state (or the non-emission period). In other words, the pulse beam emission state is determined by the pulse width designated by the computer 112. According to the present invention, the emission period is set at a relatively long time period, for example, exceeding 10 μsec, so that the relaxation oscillation occurs in the CW-pumped Q-switch laser 1. Since this is one of main points of the present invention, it will be described in detail referring to FIGS. 6 and 7.
As shown in FIG. 6, the Q-switch driver 113 receives the control pulse signal having a repetition rate of 8 kHz and a designated pulse width W1 of 50 μsec and outputs the Q-SW control signal having the emission period of 50 μsec to the ultrasonic Q-switch element 101. When setting the emission period at 50 μsec, the relaxation oscillation occurs in the CW-pumped Q-switch laser 1, resulting in a plurality of emission pulses comprising one primary emission pulse P1.sub.(50) and a plurality of secondary emission pulses P2.sub.(50) which are generated over the emission period. The secondary emission pulses P2.sub.(50) are caused by the relaxation oscillation and the intensities of the secondary emission pulses P2.sub.(50) are substantially lower than that of the primary emission pulse P1.sub.(50). In this case, the intensity of the primary emission pulse P1.sub.(50) is further lower than that of the emission pulse of the conventional laser as shown in FIG. 1. Therefore, by using such a pulse laser beam to produce the scanning laser beam 302 as shown in FIG. 4, relatively shallow marking lines can be drawn on the workpiece 303 covered with a relatively thin resin film (see FIG. 8A). The emission period of the CW-pumped Q-switch laser 1 may be adjusted depending on the characteristics of the resin of the workpiece.
As shown in FIG. 7, the Q-switch driver 113 receives the control pulse signal having a repetition rate of 8 kHz and a designated pulse width W2 of 80 μsec and outputs the Q-SW control signal having the emission period of 80 μsec to the ultrasonic Q-switch element 101. When setting the emission period at 80 μsec, the relaxation oscillation occurs in the CW-pumped Q-switch laser 1, resulting in a plurality of emission pulses comprising one primary emission pulse P1.sub.(80) and a plurality of secondary emission pulses P2.sub.(80) which are generated over the emission period. The secondary emission pulses P2.sub.(80) are caused by the relaxation oscillation and the intensities of the secondary emission pulses P2.sub.(80) are substantially lower than that of the primary emission pulse P1.sub.(80). In this case, the intensity of the primary emission pulse P1.sub.(80) is further lower than that of the emission pulse of the conventional laser as shown in FIG. 1. Therefore, by using such a pulse laser beam to produce the scanning laser beam 302 as shown in FIG. 4, relatively shallow marking lines can be drawn on the workpiece 303 covered with a relatively thin resin film (see FIG. 8B). Since the emission pulses P1.sub.(80) and P2.sub.(80) are lower in intensity than the emission pulses P1.sub.(50) and P2.sub.(50), the marking lines are produced by the emission pulses P1.sub.(80) and P2.sub.(80) at a more shallow depth than by the emission pulses P1.sub.(50) and P2.sub.(50).
Generally speaking, the repetition rate may be set at a desired value ranging from 5 kHz to 50 kHz, and the emission period, that is, the pulse width of the control pulse signal, may be adjusted within a range from 20 μsec to 200 μsec on condition that the relaxation oscillation occurs in the CW-pumped Q-switch laser 1 during the emission period. The repetition rate and the emission period may be determined depending on the kind of the resin of the workpiece and the performance of the CW-pumped Q-switch laser 1.
More specifically, in this embodiment, after selecting a desired repetition rate, the emission period is set at a value suitable for marking of the workpiece on condition that the relaxation oscillation occurs in the CW-pumped Q-switch laser 1 during the emission period.
From another view point, the computer 112 may designate the duty factor of the control pulse signal. In the present embodiment, the duty factor of the control pulse signal is more than 0.2 on condition that the relaxation oscillation occurs in the CW-pumped Q-switch laser 1 during the emission period. More specifically, the duty factor is 0.4 at a repetition rate of 8 kHz and a pulse width of 50 μsec, and the duty factor is 0.64 at a repetition rate of 8 kHz and a pulse width of 80 μsec. It is apparent that the same advantages are also obtained in this case.
In FIGS. 8A and 8B, assume that the workpiece 303 is covered with a resin containing carbon and the emission period or the duty factor is set as shown in FIG. 6 or 7. When the pulse laser beam according to the present invention is focused on a certain position of the workpiece 303, the resin at that position is heated, and thereby a relatively shallow hole 304 or 306 and a discoloration layer 305 or 307 are formed on the surface of the workpiece 303. As described above, since the pulse laser beam comprises a plurality of emission pulses in which the primary emission pulse has a relatively low intensity as shown in FIGS. 6 and 7, the vaporization of the resin is suppressed while the melt of the resin is accelerated. This causes the contained carbon to be deposited on the surface of the workpiece 303 due to the difference in a specific gravity between the resin and the carbon. After removing the deposited carbon from the surface of the workpiece 303, the discoloration layer 305 or 307 comes into view, resulting in high-contrast lines on the surface of the workpiece 303.
As illustrated in FIG. 8A, a hole 304 is formed at a relatively shallow depth due to the vaporization of the resin and the discoloration layer 305 is produced due to the melt of the resin, as mentioned above. The hole 304 and the discoloration layer 305 are formed by the pulse laser beam output from the CW-pumped Q-switch laser 1 at the repetition rate of 8 kHz and the pulse width of 50 μsec as shown in FIG. 6.
As illustrated in FIG. 8B, a hole 306 is formed at a relatively shallow depth due to the vaporization of the resin and the discoloration layer 307 is produced due to the melt of the resin, as mentioned above. The hole 306 and the discoloration layer 307 are formed by the pulse laser beam output from the CW-pumped Q-switch laser 1 at the repetition rate of 8 kHz and the pulse width of 80 μsec as shown in FIG. 7. Since the emission period W2 of this case is longer than that of the previous case as shown in FIG. 6, the intensity of the primary emission pulse P1.sub.(80) is lower than the primary emission pulse P1.sub.(50) and the total number of the emission pulses P1.sub.(80) and P2.sub.(80) is larger than that of the emission pulses P1.sub.(50) and P2.sub.(50). Therefore, the amount of the deposited carbon and the width of a marking line increase with the emission period and the depth of the marking line due to the vaporization decreases with increasing the emission period. As shown in FIG. 8B, the improved visibility of the marking lines can be achieved with a more shallow depth of the marking lines compared to the case as shown in FIG. 8A.
As mentioned above, the laser marking system according to the present invention is capable of changing the emission period of the pulse laser beam on condition that the repetition rate and the scanning speed of the pulse laser beam are kept at constant. Since the relatively long emission period causes the CW-pumped Q-switch laser to emit a plurality of laser emission pulses with relatively low intensities due to the relaxation oscillation, the marking lines are formed at a relatively shallow depth on the surface of the workpiece without decreasing the marking performance.
Further, in cases where the workpiece comprises a resin film containing carbon, a plurality of laser emission pulses due to the relaxation oscillation cause the increased amount of carbon deposition on the surface of the workpiece, resulting in the improved visibility of the marking lines.
Furthermore, since the emission period of the pulse laser beam is changed depending on a desired material of the workpiece, the optimal marking condition is easily set without decreasing the marking quality and performance regardless of the kind of a workpiece.
What is claimed is:
1. A laser marking method for marking a workpiece with a laser beam, said method comprising the steps of:
preparing a laser source which comprises a laser medium and a Q-switch element, said laser medium being continuously pumped, said Q-switch element switching on and off according to a repetition control signal, said repetition control signal comprising an emission period with a repetition rate, said repetition control signal switching said Q-switch fully off essentially instantaneously and maintaining said switched off Q-switch in its lossless state for each said emission period, and said laser source emitting said laser beam through said Q-switch element during said emission period;
adjusting said emission period of said repetition control signal such that said laser source emits a pulse laser beam comprising a plurality of emission pulses during said emission period;
changing said pulse laser beam in direction according to a predetermined pattern to generate a scanning pulse laser beam; and
focusing said scanning pulse laser beam on a predetermined surface of said workpiece.
2. The method according to claim 1, wherein said emission pulses vary in number and intensity by adjusting said emission period.
3. The method according to claim 1, wherein said emission period of said repetition control signal is adjusted such that a relaxation oscillation occurs in said laser source during said emission period.
4. The method according to claim 1, wherein said emission period of said repetition control signal is adjusted such that during said emission period, said laser source emits said emission pulses, said emission pulses comprising:
a primary emission pulse caused by a primary emission oscillation; and
a plurality of secondary emission pulses caused by a relaxation oscillation during said emission period.
5. The method according to claim 4, wherein said repetition control signal has a fixed repetition rate of 8 KHz and said emission period is 80 μsec.
6. The method according to claim 1, further comprising the step of:
placing said workpiece at a predetermined position such that said predetermined surface of said workpiece is scanned by said scanning pulse laser beam, said predetermined surface of said workpiece comprises a thermoplastic resin containing carbon:
melting and vaporizing portions of said predetermined surface of said workpiece by said scanning pulse laser beam in said predetermined pattern so that said carbon contained in said thermoplastic resin is deposited on said portions; and
removing said carbon deposited on said portions from said predetermined surface of said workpiece.
7. The method according to claim 1, wherein said emission period of said repetition control signal is adjusted by setting a duty factor of said repetition control signal.
8. The method according to claim 7, wherein said duty factor is set at 0.64.
9. The method according to claim 1, wherein said laser medium is a Nd:YAG rod and said Q-switch element is an acousto-optic diffraction switch.
10. The method according to claim 1, wherein said repetition control signal has a fixed repetition rate falling within a range from 5 kHz to 50 kHz and said emission period is adjusted to a period ranging from 20 μsec to 200 μsec.
11. The method according to claim 10, wherein said repetition control signal has a fixed repetition rate of 8 KHz and said emission period is 80 μsec.
12. A system for marking a workpiece with a laser beam, said system comprising:
a laser source comprising a laser medium and a Q-switch element, said laser medium being continuously pumped, said Q-switch element switching on and off according to a repetition control signal, said repetition control signal comprising an emission period with a repetition rate, said Q-switch being switched fully off essentially instantaneously and maintained in its lossless states for each said emission period, and said laser source emitting said laser beam through said Q-switch element during said emission period;
a laser controller for variably setting said emission period of said repetition control signal such that said laser source emits a pulse laser beam comprising a plurality of emission pulses during said emission period;
scanning means for changing said pulse laser beam in direction according to a predetermined pattern to generate a scanning pulse laser beam; and
optical means for focusing said scanning pulse laser beam on a predetermined surface of said workpiece.
13. The system according to claim 12, wherein said emission pulses vary in number and intensity by adjusting said emission period.
14. The system according to claim 12, wherein said Q-switch element comprises an acousto-optic diffraction switch; and
said laser controller comprises:
a pulse width controller for generating a control pulse signal having an ON period corresponding to said emission period in a cycle; and
a Q-switch driver for generating said repetition control signal to said Q-switch element of said laser source, said repetition control signal comprising a high-frequency wave during periods other than said emission period, said high-frequency wave causing said Q-switch element to generate a ultrasonic wave for diffraction.
15. The system according to claim 12, wherein said scanning means comprises:
a first scanning mirror for reflecting said pulse laser beam with changing in a first direction based on said predetermined pattern; and
a second scanning mirror for reflecting said pulse laser beam with changing in a second direction orthogonal to said first direction based on said predetermined pattern.
16. The system according to claim 12, wherein said predetermined surface of said workpiece comprises a thermoplastic resin containing carbon.
17. The system according to claim 12, wherein said laser controller sets said emission period of said repetition control signal by adjusting a duty factor of said repetition control signal.
18. The system according to claim 12, wherein said laser medium is a Nd:YAG rod, said Q-switch element is an acousto-optic diffraction switch, said repetition control signal has a fixed repetition rate falling within a range from 5 kHz to 50 kHz and said emission period is adjusted to a period ranging from 20 μsec to 200 μsec.
19. The system according to claim 12, wherein said repetition control signal has a fixed repetition rate falling within a range from 5 kHz to 50 kHz and said emission period is adjusted to a period ranging from 20 μsec to 200 μsec.
20. A laser marking method for marking a workpiece with a laser beam, said method comprising the steps of:
preparing a laser source which comprises a laser medium and a Q-switch element, said laser medium being continuously pumped, said Q-switch element switching on and off according to a repetition control signal, said repetition control signal comprising an emission period with a repetition rate of 8 KHz, said repetition control signal switching said Q-switch fully off essentially instantaneously and maintaining said switched off Q-switch in its lossless state for each said emission period, and said laser source emitting said laser beam through said Q-switch element during said emission period;
setting said emission period of said repetition control signal at 80 μsec, said laser source emitting a pulse laser beam comprising four emission pulses during said emission period;
changing said pulse laser beam in direction according to a predetermined pattern to generate a scanning pulse laser beam; and
focusing said scanning pulse laser beam on a predetermined surface of said workpiece.
21. The method according to claim 20, wherein during said emission period, said laser source emits one primary emission pulse and three secondary emission pulses.
22. The method according to claim 21, further comprising the step of:
placing said workpiece at a predetermined position such that said predetermined surface of said workpiece is scanned by said scanning pulse laser beam, said predetermined surface of said workpiece comprises a thermoplastic resin containing carbon;
melting and vaporizing portions of said predetermined surface of said workpiece by said scanning pulse laser beam in said predetermined pattern so that said carbon contained in said thermoplastic resin is deposited on said portions; and
removing said carbon deposited on said portions from said predetermined surface of said workpiece.
23. The method according to claim 22 wherein said laser medium comprises a Nd:YAG rod and said Q-switch element comprises an acousto-optic diffraction switch.
24. A laser marking method for marking a workpiece with a laser beam, said method comprising the steps of:
preparing a laser source which comprises a laser medium and a Q-switch element, said laser medium being continuously pumped, said Q-switch element switching on and off according to a repetition control signal, said repetition control signal comprising an emission period with a repetition rate, said repetition control signal switching said Q-switch fully off essentially instantaneously and maintaining said switched off Q-switch in its lossless state for each said emission period, and said laser source emitting said laser beam through said Q-switch element during said emission period;
adjusting said emission period of said repetition control signal such that said laser source emits a pulse laser beam comprising a primary emission pulse and at least one secondary emission pulse during said emission period, said primary emission pulse being caused by a primary emission oscillation and said at least one secondary emission pulse caused by a relaxation oscillation during said emission period;
changing said pulse laser beam in direction according to a predetermined pattern to generate a scanning pulse laser beam; and
focusing said scanning pulse laser beam on a predetermined surface of said workpiece.
25. The method according to claim 24, further comprising the step of:
placing said workpiece at a predetermined position such that said predetermined surface of said workpiece is scanned by said scanning pulse laser beam, said predetermined surface of said workpiece comprises a thermoplastic resin containing carbon;
melting and vaporizing portions of said predetermined surface of said workpiece by said scanning pulse laser beam in said predetermined pattern so that said carbon contained in said thermoplastic resin is deposited on said portions; and
removing said carbon deposited on said portions from said predetermined surface of said workpiece.
26. The method according to claim 25 wherein said laser medium comprises a Nd:YAG rod and said Q-switch element comprises an acousto-optic diffraction switch.
27. A system for marking a workpiece with a laser beam, said system comprising:
a laser source comprising a laser medium and a Q-switch element, said laser medium being continuously pumped, said Q-switch element switching on and off according to a repetition control signal, said repetition control signal comprising an emission period with a repetition rate, said Q-switch being switched fully off essentially instantaneously and maintained in its lossless states for each said emission period, and said laser source emitting said laser beam through said Q-switch element during said emission period;
a laser controller for setting said emission period of said repetition control signal such that said laser source emits a pulse laser beam comprising a primary and at least one secondary emission pulse during said emission period;
scanning means for changing said pulse laser beam in direction according to a predetermined pattern to generate a scanning pulse laser beam; and
optical means for focusing said scanning pulse laser beam on a predetermined surface of said workpiece.
28. The system according to claim 27, wherein said Q-switch element comprises an acousto-optic diffraction switch; and
said laser controller comprises:
a pulse width controller for generating a control pulse signal having an ON period corresponding to said emission period in a cycle; and
a Q-switch driver for generating said repetition control signal to said Q-switch element of said laser source, said repetition control signal comprising a high-frequency wave during periods other than said emission period, said high-frequency wave causing said Q-switch element to generate a ultrasonic wave for diffraction.
29. The system according to claim 27, wherein said scanning means comprises:
a first scanning mirror for reflecting said pulse laser beam with changing in a first direction based on said predetermined pattern; and
a second scanning mirror for reflecting said pulse laser beam with changing in a second direction orthogonal to said first direction based on said predetermined pattern.
30. The system according to claim 27, wherein said predetermined surface of said workpiece comprises a thermoplastic resin containing carbon. fiber laser marking systems
31. The system according to claim 27, wherein said laser controller sets said emission period of said repetition control signal by adjusting a duty factor of said repetition control signal.
32. The system according to claim 27, wherein said laser medium is a Nd:YAG rod, said Q-switch element is an acousto-optic diffraction switch, said repetition control signal has a fixed repetition rate falling within a range from 5 kHz to 50 kHz and said emission period is adjusted to a period ranging from 20 μsec to 200 μsec.
33. The system according to claim 27, wherein said repetition control signal has a fixed repetition rate falling within a range from 5 KHz to 50 KHz and said emission period is adjusted to a period ranging from 20 μsec to 200 μsec.
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Wed, May 13th - 2:34AM
fiber laser marking
Features
Smal size, impact structure, portable and light.
Application Materials
laser marking machine can work with most metal marking applications, such as Gold, Silver, Stainless Steel, Brass,
Aluminium, Steel, Iron etc, and can also mark on many non-metal materials, such as ABS, Nylon, PES, PVC, Makrolon.
Applicable Industries
Mechanical Parts: fiber laser marking
Bearings, Gears, Standard Parts, Motor, etc.
Instrument:
Panel Board, Nameplates, Precision equipment, etc.
Hardware Tools:
Knives, Tools, Measuring Tools, Cutting Tools, etc.
Daily Necessities:
Handicrafts, Zipper, Key Holder, Sanitary Ware, etc
Automobile Parts:
Pistons and Rings, Gears, Shafts, Bearings, Clutch, Lights, etc.
Electronic Components:
Resistors, Capacitors, Chips, Printed Circuit Boards, Computer Keyboard, etc.
Advantages
1) Small size and compact structure, convenient to move.
2) Long lifespan of fiber laser source: 100 000 hours
3) good scanning galvanometer, with good seal, small volume, compact.
4) good Scaps controller, USB interface, swift and stable transmission, can work with a Laptop.
5) High Precision: upto 0.0012mm, bring you the fantastic and satisfied marking effect. fiber laser marking
6) Superior Laser Beam: the definition is 1 micron, 10 times as that of traditional products.
7) No Consumables: One Fiber marker can work for more than 10 years without any consumables.
8) Fast Speed: 800 standard characters per second, is 3 to 5 times above that of traditional products.
9) The fiber laser beam no need to adjust the laser optical path.
10) Low consumption: <400W, is 1/25 ~ 1/10 times as that of Diode and YAG, more economized and environmental.
11) Strong Compatibility: TTF Font, SHX, BMP, DXF, AI, PLT and other format files output from CorelDraw, PS, AutoCAD,
etc..
12) Integrated Air Cooling System: The cooling effect is more excellent than the water cooling effect in YAG laser,
no maintenance.
13) Deeper Marking: Max. 1.2mm stainless steel, suitable for the industries which needs high precition and depth
marking effect. fiber laser marking
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Mon, May 4th - 3:59AM
What is a polarizing filter?
No matter whether you are a professional photographer or you just want to make nice pictures, it is essential to be
familiar with the basic camera tools that can not only enhance an image, but change it entirely. Probably the most
basic of those tool, the polarizing filter is definitely amongst the most used ones in photography.http://www.opticalglasscn.com
It is placed in front of the camera lenses and its purpose is to darken different sights, change the color and
contrast saturation as well as to suppress glare and reflections. Since the light from the sun goes through the
atmosphere, a part of it is polarized by the reflection from electrons in the air. This to some extent messes with
the color balance in a picture and it is the polarizer’s job to fix it.
For example if you are trying to take a picture of someone through a window, the usual result will be you seeing
yourself taking it. With a filter adjusted to the proper angle your reflection can be cut out entirely and the window
would appear to be almost invisible. This effect is particularly artistic for images of water surfaces, especially
ones that have objects on top of them. Everything becomes better outlined and more vivid. However, you have to be
aware of unwanted effects such as vignetting, as sometimes the angle varies through the photo and makes its edges to
appear sketchy.
The rotation mechanism of the filter is adjusted in order to achieve the different effects. Most modern cameras use a
circular polarizer, yet there are the linear and the quarter-wave ones, which convert the linearly polarized light
into a circular one.http://www.opticalglasscn.com However, it is up to the photographer to find the right angle from which to shoot. Because of
its sensitivity effects often vary greatly just with one touch and can be rather uneven if you use wide lenses. This
is so because as the landscape is bigger parts of it will be lighted from a different angle. This is also a very
common reason for vignetting and for unwanted play of shadows, as the polarizing effects are stronger in one part of
the picture and weaker in another.
Summarized in conclusion, the polarizers serve a wide variety of functions for the professional photographer. They
enhance the colors, especially of the sky, remove reflections and glare, as well as influencing contrast. Their
quality and featureshttp://www.opticalglasscn.com vary with the different models, but no matter which one you decide always remember that it is
the person taking the picture who determines the final outcome.
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Mon, May 4th - 2:39AM
some information about fiber laser marking
Feature
The new generation of fiber laser marking system has the revolutionary ：
1. It has volume slightly, the semiconductor module has got long life (>500 thousand hours), the power consumption is
low (160Q) 、The beam quality is high, the USB connection, supports WIN98/2000/XP and other operating system.
2. It is not influenced by bad circumstance and temperature change; May use the ac c umulator cell and an autom o b
ile smoke under the power cut condition and so on carries on the operation. http://www.lasermarkingcnc.com
Before Fiber laser appeared, laser marking system normally adopts Continuous or pulse output CO2 laser tube, ND-YAG
Laser tube as laser source. Compared with traditional laser source, the performance of fiber laser is more excellent,
Radiation angle is 1/4 of Diode-pumped laser tube (more suitable for precise and fine marking); the conversion
efficiency of electro-optic is 1/10 of lamp pumped solid laser marker; The average working time reaches 100,000
hours;
3. Fiber laser is a type of full air cooling, so it doesn’t need refrigerant device, freezing water pipe or
temperature controller, the volume is reduced, energy consumption is decreased, so the use cost of user is much
lower than use cost of traditional laser marking system.
4.The pulse of ETL Fiber laser is 10-100KHz repeat frequency working, The volume of the fiber laser which average
power output is 10W-20W is only 46*160*250cm, and weight is 10kg; Because laser diode is working in low voltage, the
conversion efficiency of electro-optic is up to 70%, and driving power supply can use UPS power supply when the power
is shut off the power consumption is only 160W.
Parameter
Power: 20W
Laser length: 1060nm
Laser power: 20KHZ-80KHZ continual
Power supply: Single phase AC 220V/50HZ-60HZ
Electricity power: < 160W
Machine dimension: 570mm×270mm×200mm
Wet weight: < 22KG
Focusing spot diameter: <0.01mm
Marking area: 30mm/30mm-300mm/300mm optical
Marking speed: > 800character/s
Semiconductor life: > 500,000 hour
Marking depth: 0.01-0.2mm
Operational system: Win98/Win2000/XP
Cooling mode: Air cooling
Controlling joint: Standard USB
Ac c ept typeface and document format: WINDOWS operating system fonts all typefaces/Font (including various countries
language and writing/Bar code and so on); BMP/Belt 256 gradation images document and DXF/ and so on PCXPLT form
vector graphic file
Fiber Laser Marking Machine Applications:http://www.lasermarkingcnc.com
Widely used in electronic part and component,electrical engineering,electrical appliance,telecommunication
products,car and motorcar spare part, instrument and meters,plastic case, aviation and aerospace,military
product,hardware fitting and accessory,facility,measuring implement, cutting tool, sanitary appliance, stationery,
medicament, food and beverage, make-up, medicine packaging, medical instrument, clock and jewelry, light-through key
board, glasses,solar PV, craft and etc.area. Widely suitable for various metals, alloy,metallic oxide materials and
some non-metallic materials (silicon wafer, ceramics, plastic, rubber, epoxy resin, ABS, printing ink,
plating,spraying,coating film and etc. external materials)
Technoligy Characters：
1.Fiber Laser Hi-speed Galvo Scanner, red light preview
2.High precision and unified rotative homothermal water cooling system;
3.Strong software function, user friendly interface,Set and deal separately
4.Professional control software is compatible with AutoCAD, CoreIDAW, Photoshop and etc. software outlet.
5.It could achieve the auto arrangement and amendment of letter,symbol, pattern, figure, image,bar code, 2D code,
http://www.lasermarkingcnc.com
serial number, auto increasing and etc.
6.It supports PLT, PCX, AI, DXF, BMP, JPG and etc. various formats, it is also avaliable by using TIF,SHX character
code.
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Name: Emily James
